Nanoparticle Engineering for Chemical-Mechanical Planarization
Ungyu Paik
ISBN: 9781420059113
Vydavateľstvo: CRC Press
Rok vydania: 2009
Väzba: Hardback
Počet strán: 224
Pôvodná cena: 199,63 €
Výstavná cena:
169,69 €(t.j. po zľave 15%)
(Cena je uvedená vrátane 10% DPH)
Katalógová cena: 120 GBP
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Increasing reliance on electronic devices demands products demostration high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.